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金属特征选择指南&技术论文
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Wrought Clad Inlay Palladium-Nickel
Contact Material Systems for
Dry Circuit Applications
P. W. Lees
Technical Materials, Inc.
Subsidiary of Brush Engineered Materials, Inc.
Lincoln, R.I. USA
ABSTRACT
Palladium based contact materials have been used successfully in telecommunications, computer and automotive dry circuit applications. Deleterious frictional polymer formation is prevented by coating Palladium and Palladium co-deposits with a gold surface layer. Nobility is maintained at lower cost when compared to gold over nickel at equivalent thickness. Current electroplated systems include thick gold or a gold flash over Palladium (Pd) and Palladium-nickel (PdNi). The properties and performance characteristics of electroplated PdNi coatings are a function of the Palladium-nickel bath chemistry, plating manufacturing practice and the ability to control the Palladium-to-nickel ratio. In contrast, a consistent and reproducible alloy chemistry is intrinsic to metallurgically processed materials. This paper characterizes the properties of wrought PdNi contact materials. The bulk PdNi alloys exhibited hardness values( 300 HV500, bend R/t ratios of less than 1.0, an average electrical resistivity of 21.5 ((-cm, excellent oxidation resistance and moderate chemical stability. Diffused gold (DG) and gold flash (GF) clad inlay PdNi materials demonstrated excellent thermal and chemical stability, and proved durable when cycled against plated hard gold. Both DG and GF clad inlay PdNi contact materials exhibited preferred performance attributes. Cost estimates for both wrought and electroplated systems are presented.
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