TMI Technical Materials, Inc.   a Brush Engineered Materials company         •site map     •home

Markets &
Applications
•Overview
•Telecom
•Computer
•Automotive
•Jewelry
•Medical
•Aircraft
•Fuel Cells
•Thermal Management



Product Features

2. Wire Bond Hybrid Module
 
   Typical base materials for these lead frame type applications are Cu alloys such as C 194 and C 519. The wire bondable surface for thick wire bonding is a clad Al product. The wire bondable surface for thin Au wires is usually an electroplated soft Au.

 Typical Material Systems

 
•About TMI    •Products    •Markets / Applications    •Metal Properties Guide / Tech Papers    •Contact Us    •Brochures    •Site Map    •Home   

TMI 5 Wellington Rd. Lincoln, RI 02865 Phone: 401-333-1700 Fax: 401-333-2848