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Technical Papers Available from TMI
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33.
Evaluation of Wire Bond Systems For Manufacturability
Authors:D.W.M. Williams, L. Chen, B. Njoes, M. McKeown, R. Venkitaswamy
32. Engineered Metallic Strip for Fuel Cell Applications
Authors: L. Chen, P Lynch, J. Kaiser
31. Roll-Bonded Clad Metal Foils as Ag-Cu-Ti Active Brazing Filler Metals
Authors: L. Chen, R.P. Willis, P.F. Lynch, J. Kaiser
30. Engineered Metallic Strips by Cladding and Plating for Fuel Cell Applications
Authors: L. Chen, R.P. Willis, P.F. Lynch, J. Kaiser
29. Development
and Application of Connector Contact Material Systems for Elevated Temperature
Exposure.
Authors: Philip W. Lees
28. On The
Upper Temperature Limit for Tin Connector Contact Surfaces
Authors: Philip W. Lees
27. An Evaluation
of Aluminum Wire Bondable Surfaces for Automotive Lead Frame Applications
Authors: Philip W. Lees
26. Technical
Overview of Silver as a Candidate Contact Material for Automotive Connectors
Authors: Philip W. Lees
25. The Influence of Stamping Die Design on the Selectivity of Electroplated Coatings on Connector Contact Surfaces
Authors: Ulrich Greschner and Philip W. Lees
Presented at: IICIT 2001
24. Correlation of Changes in Coefficient of Friction and Contact Failure During Sliding Wear Experiments
Author: Philip W. Lees
Presented at: IICIT 2001
23. The Influence of Surface Defect Size on the Wire Bond Pull Strength for Automotive Lead Frame Materials
Author: Philip W. Lees
Presented at: IMAPS 2001
22. Comparison of Coefficient of Friction and Contact Resistance During Sliding Wear on Clad Gold-Nickel Surfaces
Authors: Nicole Gabel, Harry Hardee, Philip Lees
Presented at: HOLM 2001
21. Wear Properties of Commercially Processed Thin Gold Alloy Connector Contact Materials
Author: Philip W. Lees
Presented at: IICIT 2000
20. Preliminary Report on the Properties of Thin Au Alloy Connector Contact Materials for Telecom Applications
Author: Philip W. Lees
Presented at: IICIT 1999
19. Sliding Wear Experiments On Clad Gold-Nickel Material Systems Lubricated With a 6-Ring Polyphenyl Ether
Authors: Neil Aukland, Harry Hardee, Philip Lees
Presented at: HOLM 2000
18. A comparison of a clad material (65Au21Pd14Ag) and an electroplated gold over palladium material system under fretting conditions at elevated temperatures.
Authors: Neil Aukland, Harry Hardee, Anna Wehr-Aukland, Phillip Lees
Presented at: HOLM 1999
17. Clad Aluminum Bond Surfaces on Lead-frames for Gold Fine Wire Bonding
Author: Philip W. Lees
Presented at: IMAPS 2000
16. Mass Diffusion in Polycrystalline Metal/Electroplated Gold Planar Couples
Author: Philip W. Lees
Presented at: ICEC 1998
15. The Influence of Coating Technology on the Mechanical Performance of Thin, High Performance Connector Springs
Author: Philip W. Lees and Ulrich Greschner
Presented at: IICIT 1998
14. A New Wrought Contact Alloy for High Temperature Applications
Author: Philip W. Lees and Ulrich Greschner
Presented at IICIT 1997
13. An Examination of the Metalic Bonding of a Clad Material and Two Gold Plating Systems under Constant Force Fretting Conditions
Author: Philip W. Lees and New Mexico State University
Presented at: HOLM 1997
12. A Statistical Comparison of a Clad Material and Gold Flashed Palladium-Nickel Under Various Fretting Conditions
Author: Philip W. Lees
Presented at: HOLM 1995
11. Combating Corrosion in High Reliability Connectors
Author: Philip W. Lees
Reprinted from: Connector Specifier 1995
10. Interdiffusion Between Connector Contact Materials and Nickel Diffusion Barriers During Precipitation Hardening of High Performance Spring Materials
Author: Philip W. Lees
Presented at: HOLM 1994
9. The Effect of Test Environment on the Creep of Base Metal Surface Films Over Precious Metal Inlays
Author: David W.M. Williams
Presented at: HOLM 1987
8. The Influence of Manufacturing Technology on the Effectiveness of Nickel Diffusion Barriers for High Temperature Dry Circuit Applications
Author: Philip W. Lees
Presented at: ICEC 1990
7. A Comparison of Electroplated Gold Flash Palladium-Nickel and Wrought, Clad Inlay WE#1 Capped Palladium-Silver
Author: Philip W. Lees
Presented at: IICIT 1995
6. Wrought Clad Inlay Palladium-Nickel Contact Material Systems for Dry Circuit Applications
Author: Philip W. Lees
Presented at: IICIT 1992
5. A Low Cost, High Reliability Contact Finish for Automotive Applications
Author: Philip W. Lees
Presented at: IICIT 1993
4. Clad Metal Material Systems Provide Solutions for Automotive Under-Hood Connector Applications
Author: Philip W. Lees
Reprinted from: Design News 1991
3. Diffused Gold R156 - A New Inlay Contact Material for Bell System Connectors
Author: Frank E. Bader
Presented at: 11th International Conference on Electric Contact Phenomena 1982
2. A Comparison of Precious Metal Contact Materials
Author: David W.M. Williams and H.A. Wiegard
1. Metal-to-Metal Cladding
Author: David W.M. Williams
Reprinted from: Connection technology 1991
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