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Clad Aluminum Bond Surfaces on Lead-frames
for Gold Fine Wire Bonding
Philip W. Lees,
Technical Materials, Inc.
Lincoln, R.I.
Abstract
Clad aluminum bond surfaces have been successfully used on lead-frames for both fine and coarse aluminum wire bonding. In spite of the raw material cost, fine wire gold bonding offers advantages over fine aluminum wire bonding. Aluminum is now a common chip bond pad metallization and manufacturing and assembly processes have been developed to assure reliable bonds between aluminum metallization and fine gold wire. However, the traditional bond surface on lead-frames has been soft gold. This paper examines some recent trends in automotive sensor lead-frame material design, details hypothetical and actual bonding failure modes for spot electroplated soft gold, and proposes an alternative lead-frame design using aluminum bond surfaces to address the material related failure modes. Preliminary data are presented which identify differences in failure mode response between the Au- pad, Au-wire system and the proposed Al-pad, Au-wire system.
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