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The Influence of Stamping Die Design on the Selectivity of Electroplated Coatings on Connector Contact Surfaces
Ulrich Greschner and Philip W. Lees
Technical Materials, Inc.
Lincoln, RI 02865
Abstract: In order to achieve low manufacturing and low material costs for high reliability connectors, stamping throughput must be maximized and precious metal content must be minimized. Using a dual beam connector as the model, conventional stamping lay-out methods and their impact on the ability to selectively apply precious metal coatings are discussed. It is found that the conventional lay-out results in a compromise between high throughput and precious metal consumption. An alternative lay-out is then presented which lends itself to both high stamping throughput and a new, highly selective plating technology. The shortcomings of the conventional lay-out are overcome resulting in maximum stamping throughput and minimum precious metal consumption.
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