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Evaluation of Wire Bond Systems for Manufacturability
Dr. D.W.M. Williams
Dr. Lichun Leigh Chen
Barry Njoes
Technical Materials Inc.
5 Wellington Road
Lincoln, RI 02865 |
Michael McKeown
Orthodyne Electronics
16700 Red Hill Avenue
Irvine, CA 92602
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Dr. Raju Venkitaswamy
Farmingdale State College
2350 Broadhollow Road
Farmingdale, NY 11735
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Abstract As automotive electronics evolve, interconnects between logic processor units and the remote sensors or actuator components play a critical role in assuring reliability and low manufacturing cost of major control systems. These interconnects are typically aluminum wires attached by ultrasonic wire bonding. Several types of substrates are used to mount the logic microprocessors, and facilitate the wire bonding attachment operation.
This paper evaluates two different substrates/coatings for optimal wire bonding characteristics. The substrates/ coatings are aluminum inlay and electroplated nickel phosphorous. Wire bond evaluations included pull testing, shear testing and bond remnants characterization for each of the substrates. Additionally, wire diameter was varied to identify process manufacturing parameters that consistently and repeatedly produced functional wire bonds.
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